Thermal
Semiconductor Packaging
As chip packages shrink and power densities rise, managing heat becomes one of the hardest constraints in semiconductor design. Package-level thermal margins directly affect performance, reliability, and yield.
What's being solved
- Junction-to-case and junction-to-ambient thermal resistance
- Conjugate heat transfer across die, substrate, and package materials
- Localized hotspot formation under transient workloads
Where the platform fits in
- Helps engineers model package-level thermal behavior earlier in the design cycle.
- Supports rapid comparison of packaging and cooling configurations.
- Keeps thermal assumptions traceable as designs evolve.
Design candidates explored against the constraints that matter here
Simulation domains that apply here
The analyses this sector runs most, and how each one is set up on the platform.
Thermal Analysis
Understand how heat moves through components, assemblies, and systems.
Conjugate Heat Transfer Analysis
Model coupled solid conduction and fluid convection together.
Talk to us about semiconductor packaging.
Open the platform if you already have access, or request a demo and bring us the engineering problem you are working on.